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| Item | Specification |
| Series | 3.0FX / MX3.0 Wafer Connector |
| Pitch | 3.0 mm |
| Pin Count | 16 Pin (12 Signal + 4 Power) |
| Arrangement | Dual Row |
| Orientation | 180° Straight |
| Termination Type | DIP / Through Hole |
| Housing Material | PA66 / LCP, UL94V-0 |
| Contact Material | Brass |
| Plating | Matte Tin / Bright Tin |
| Rated Voltage | 250V AC/DC |
| Rated Current | 5A per Pin |
| Contact Resistance | ≤ 10 mΩ |
| Insulation Resistance | ≥ 1000 MΩ |
| Withstand Voltage | 1000V AC for 1 minute |
| Operating Temperature | -25℃ ~ +85℃ |
| Soldering Temperature | Peak 260℃ |
| Mating Cycles | ≥ 30 times |
| Insertion Force | ≤ 1.0 kgf per Pin |
| Extraction Force | ≥ 0.35 kgf per Pin |
| Compliance | RoHS, Halogen Free |
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